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Installation and Operation
R2A*
R2H*
PAD1 R1A*
(3)
R3A*
R3H*
R1H* (3) PAD8
R2B*
C1A*
C1H*
R2G*
PAD2 R1B*
(3)
R3B*
C1B*
1
8
R3G*
C1G*
R1G* (3) PAD7
2
3
7
6
R2C*
4
UX
5
R2F*
PAD3 R1C*
(3)
R3C*
R3F*
R1F* (3)
PAD6
R2D*
C1C*
C1F*
R2E*
PAD4 R1D*
(3)
R3D*
C1D*
V SS
C2 (2)
V DD
R3E*
C1E*
R1E* (3) PAD5
V DD
V SS
To power plane
C1 (2)
To ground plane
V DD
C3 (2)
V SS
TP11
TP13
TP15
P1 (1)
P2 (1)
P3 (1)
TP12
TP14
TP16
TP17
P4 (1)
TP18
*
Note 1:
2:
3:
FIGURE 2-1:
Optional components, circuit-dependent.
Can be any passive component (R, C, ...) that fits onto a 805 surface-mount footprint.
Optional power/device filtering capacitors.
When installing this component, ensure to cut the trace between the two pads of the device.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Circuit.
? 2005 Microchip Technology Inc.
DS51544A-page 9
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